Sn3.0Ag0.5Cu焊材与基体间IMC层微结构演化及力学行为分析

Analysis on Microstructure Evolution and Mechanical Behavior of IMC Layer between Sn3.0Ag0.5Cu Welding Material and Matrix

以Sn3.0Ag0.5Cu焊接材料为研究对象,分析了Sn3.0Ag0.5Cu焊接材料与基体间IMC层的微观结构,探索了IMC微结构对焊锡接点断裂模式和拉伸强度的影响。结果表明,Sn3.0Ag0.5Cu/Cu界面是由IMC层、Sn3.0Ag0.5Cu焊料和Cu基体3部分组成。EDS定性分析了界面处的组织成分,发现有金属间化合物Cu3Sn和Cu6Sn5的存在。焊锡接点的断裂方式随着时效时间的延长,逐渐由韧性断裂转换为脆性断裂,拉伸强度并不是处于一直降低的状态,出现了一个小波动。

Taking Sn3.0Ag0.5Cu welding material as research object, the microstructure of IMC layer between Sn3.0Ag0.5Cu welding material and matrix was analyzed, the effect of IMC microstructure on fracture mode and tensile strength of soldering tin contact were explored. The results show that the Sn3.0Ag0.5Cu/Cu interface is composed of three parts of IMC layer, Sn3.0Ag0.5Cu solder and Cu matrix. The composition of interface was qualitatively analyzed by EDS,it is found that the existence of the intermetallic compounds Cu3 Sn and Cu6Sn5. With the aging time increasing, the fracture ways of soldering tin contact gradually transform from ductile fracture to brittle fracture, and the tensile strength is always not in the state of reducing, there is a small fluctuations.