摘要
以Sn-9Zn/Cu焊点为参比物,研究了Sn-8Zn-3Bi/Cu焊点在85℃时效条件下界面金属间化合物(IMC)的生长行为。结果表明,相同钎焊工艺条件下,与Sn-9Zn/Cu相比,Sn-8Zn-3Bi/Cu界面反应更为充分。在85℃时效过程中,Sn-9Zn/Cu界面IMC结构稳定,Sn-8Zn-3Bi/Cu焊点界面IMC生长速率变化不大,界面IMC层增厚速率在界面反应初期较快而在后期则显著下降。Bi的添加对合金熔点的降低促进了界面初期反应过程的充分进行。随着界面反应时间的延长,Bi对Cu-Zn(IMC)层的生长表现出明显的抑制作用,界面IMC生长动力学时间指数显著减小。
By comparing with Sn-9Zn/Cu joints,the growth behavior of interfacial intermetallic compound（IMC）in Sn-8Zn-3Bi/Cu joints with isothermal aging at 85℃ was investigated.The results show that the interfacial reaction of Sn-8Zn-3Bi/Cu exhibits more sufficient compared with Sn-9Zn/Cu at the same soldering process.During isothermal aging at 85 ℃,the interfacial IMC layer exhibits stable and the change of growth rate of IMC at the interface of Sn-8Zn-3Bi/Cu joints becomes slight.The growth rate of the interfacial IMC layer of Sn-8Zn-3Bi/Cu joints exhibits fast at initial stage,and then slow down obviously.The melting point of solder is decreased due to the addition of Bi,resulting in a sufficient reaction of interface at the initial stage.With increasing in interfacial reaction time,the suppression effect of Bi on Cu-Zn IMC appears significantly,and the time index of growth kinetics is decreased markedly.
出处
《特种铸造及有色合金》
CAS
CSCD
北大核心
2015年第1期91-93,共3页
Special Casting & Nonferrous Alloys
基金
重庆市教委科研项目(KJ132105)
重庆工业职业技术学院科研项目(GZY201210-YK)
