摘要
可焊性测试仪是电子元器件在生产过程中、筛选复验和装机前进行可焊性测试的仪器,其技术指标包括温度、润湿力、浸渍深度、速率和时间论文依据相关国家检定规范,通过实践研究,实现了可焊性测试仪这些技术指标的校准。
The solderability tester is an instrument,which is used to test the solderability of the electronic components during the producing progress,screening retest and before loading the weapon system.According to relative verification regulation,on the basis of the practical work,the calibration method of the electronic component solderability tester is discussed,the calibration of such technical specifications as temperature,wetting balance,dipping depth,dipping rate and dipping time etc is realized.
出处
《计算机与数字工程》
2015年第1期7-9,79,共4页
Computer & Digital Engineering
关键词
电子元器件
可焊性测试仪
校准方法
electronic component
solderability tester
calibration method
