摘要
电子元器件是整机的基础,在装备的生产和使用过程中,元器件工作异常将影响整个装备的正常运行,元器件发生故障时,必须迅速、准确地进行故障分析和失效定位,避免军用装备在关键时刻发生故障。显微红外热成像技术是一种对电子元器件的微小面积进行高精度非接触的测量,能够显示元器件的反常热分布,暴露不合理的设计和工艺缺陷。论文介绍了显微红外热像仪的原理及特点,举例说明了显微红外热成像技术在失效分析故障定位中的应用,对元器件的故障失效分析和有效性检测提供了指导作用。
Electronic component is the basis of arm facility,which can influence the product quality in the process of manufacture and application.For this reason,fault location of failure analysis must be fond as soon as possible to avoid any fault.Infrared thermal imaging technology is a kind of high accuracy non-contact measurement of the electronic components＇tiny areas.This technology can display the anomalous heat distribution of components,exposure unreasonable design and technical shortcomings.In this paper,the principle and characteristic of thermal microscope is introduced,and the application of microscopic infrared temperature measurement in fault location of failure analysis is illustrated,and guidance on the failure analysis and effectiveness detection of components is provided.
出处
《计算机与数字工程》
2015年第1期133-136,共4页
Computer & Digital Engineering
关键词
电子元器件
失效分析故障定位
显微红外热成像技术
electronic component
fault location of failure analysis
microscopic infrared temperature measurement
