废弃环氧塑封材料的资源化利用

Resource Utilization of Waste Epoxy Molding Materials

将电子封装过程中产生的废弃环氧模塑料球磨成200目的粉末,用硅烷偶联剂KH-560进行表面改性后,添加到高密度聚乙烯(HDPE)中制备成复合材料。红外测试表明,KH-560与废弃环氧模塑料粉末之间具有明显的相互作用。改性废弃环氧模塑料粉末与基体HDPE具有更好的相容性,在对HDPE基本性能(强度、韧性、加工流动性等)影响不大的前提下,改性废弃环氧模塑料粉末的添加量可达20%,而未改性废弃环氧模塑料粉末的添加量仅为5%。废弃环氧模塑料粉末的添加对基体HDPE具有增强作用,与纯HDPE相比,复合材料拉伸强度的增幅接近25%。

Waste epoxy molding compound （WEMC） powder （200 mesh） produced from electronic packaging was prepared by milling, which was further modified with silane coupling agent KH-560. The powder was added to the high density polyethylene （HDPE） for fabricating composites. FT-IR showed that coupling reaction took place between KH-560 and WEMC. The surface modification introduced better compatibility of WEMC powder and the matrix HDPE. Maintaining the performance of HDPE （ strength, toughness, processing fluidity ）, adding proportion of modified WEMC powder could reach 20%, the unmodified WEMC powder was only 5%. The enhancement of polyethylene matrix composite resulted from the WEMC powder filled. The tensile strength was 25% greater for the composites than those samples of pure HDPE.