LED封装用环氧树脂/金刚石导热胶的研制

Preparation of Epoxy Resin/Diamond Thermal Conductive Adhesive for LED Packaging

以双酚A环氧树脂为基体树脂,添加平均粒径为10μm的金刚石作为导热粒子,制备了高导热低膨胀导热胶。此环氧树脂/金刚石导热胶体系完全固化的最佳条件为125℃/1 h+150℃/1 h。当金刚石添加量为40%时,所制备的导热胶导热系数达0.85 W/(m·K),热膨胀系数为33.15×10-6/℃,已能完全满足LED封装用导热胶的技术要求;当金刚石添加量达到50%时,导热胶的导热系数达1.07 W/(m·K),热膨胀系数为16.65×10-6/℃,且体系流动性好,固化物有较高的强度和韧性。

The thermal conductive adhesive with high thermal conductivity and low expansion coefficient were prepared by using bisphenol A epoxy as matrix resin and diamonds with an average diameter of 10 μm as thermal conductive particles. The optimal curing conditions of epoxy resin/diamond system were 125℃ /1 h＋150℃ /1 h. When the diamond dosage is up to 40%, the thermal conductivity can reach to 0.85 W/（m·K） and the thermal expansion coefficient is 33.15×10^-6/℃, which could fully meet the technical requirements of the conductive adhesive used for LED packaging. When the amount of diamond is 50%, the thermal conductivity of the thermal adhesive reaches 1.07 W/（m·K） and the thermal expansion coefficient is 16.65×10^-6/℃. The fluidity of the system is good and the strength and toughness of cured product are good too.