摘要
综述了填充型树脂基导热绝缘复合材料的研究现状,介绍了该材料的制备方法及其在电机及封装等领域的应用情况,总结了影响填充型树脂基导热绝缘复合材料导热性能的主要因素,并展望了高导热绝缘复合材料的发展方向。
The research situation of filled-type resin-based thermal conductive insulating composites was reviewed, and their preparation method and application situation in motor and packaging field were introduced. The main influence factors of thermal conductivity for filled-type resin-based thermal conductive insulating composites were summarized.
出处
《绝缘材料》
CAS
北大核心
2015年第3期8-11,共4页
Insulating Materials
关键词
填充型
树脂基
导热
复合材料
无机粒子
filled-type
resin-based
thermal conductive
insulating
composites