摘要
A novel hybrid III-V/silicon deformed micro-disk single-mode laser connecting to a Si output wave- guide is designed, and fabricated through BCB bonding technology and standard i-line photolithography. Com- pared to a traditional circular micro-disk in multi-longitudinal-mode operation, unidirectional emission and single longitudinal-mode output from a Si waveguide are realized. In the experiments, an output power of 0.31 mW and a side-mode suppression ratio of 27 dB in the continuous-wave regime are obtained.
A novel hybrid III-V/silicon deformed micro-disk single-mode laser connecting to a Si output wave- guide is designed, and fabricated through BCB bonding technology and standard i-line photolithography. Com- pared to a traditional circular micro-disk in multi-longitudinal-mode operation, unidirectional emission and single longitudinal-mode output from a Si waveguide are realized. In the experiments, an output power of 0.31 mW and a side-mode suppression ratio of 27 dB in the continuous-wave regime are obtained.
基金
Project supported by the Chinese National Key Basic Research Special Fund(No.2012CB933501)
the National Natural Science Foundation of China(Nos.61025025,61274070,61234004,61307033)
the National High Technology Research and Development Program of China(No.2012AA012202)