轻质无胶蔗渣板的研究

Study on ultra-low density bagasse binderless particleboard

以蔗渣为原料,不采用合成树脂,而是加入少量环保型添加剂(有机酸或糖)压制轻质无胶蔗渣板。探讨了板的密度,以及防水剂的有无对轻质无胶蔗渣板的物理力学性能及热学性能的影响。采用X射线衍射仪(XRD)、傅里叶变换红外光谱仪(FTIR)初步分析了加入添加剂、防水剂对板的物理力学性能及胶合机理的影响,结果表明:随着密度增大,板的导热性能,MOR值和TS值上升;加入添加剂后,板的纤维素结晶度增大;加入少量防水剂(石蜡)后,板的纤维素结晶度没有明显变化,—OH吸收峰强度下降,TS下降明显;在研究范围内,板的导热系数达到国家林业行业标准LY/T 1718-2007所要求的保温材料的要求。本研究既扩大了人造板生产的原料来源,又解决了人造板产品的游离甲醛释放问题。

By taking bagasse as the raw material, without using any synthetic resin, but adding a little environmental-friendly additives（organic acid or sugar）, a kind of ultra-low density binderless bagasse particleboard was manufactured. The effects of board density, waterrepellent（wax） on physical and mechanical properties and thermal properties of binderless particleboard were studied. By adopting X-ray diffraction（XRD）, Fourier transform infrared spectroscopy（FTIR）, the effects of mixing additives and water repellent on physical and mechanical properties and bonding mechanism of the bagasse boards were also investigated and analyzed. The results show that the thermal conductivity, TS value and MOR value increased with the increases of board density; The crystallinity of cellulose increased after added additives; By adding a small amount water repellent, though the cellulose crystallinity did not change significantly, the intensity of-OH absorption peak decreased, and the TS value decreased significantly; The thermal conductivity of binderless particleboard can meet the requirements of the National Standard LY/T 1718-2007. This study not only enlarged the raw materials sources of board production, but also solved the problem of formaldehyde emission of wood-based panels.