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基于Dynaform的波形片成形回弹研究 被引量:13

Study on springback in cushion segment forming based on Dynaform
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摘要 以某离合器波形片为研究对象,利用Dynaform有限元软件对波形片的成形回弹进行数值模拟,分析了波形片回弹前与回弹后的应力分布,研究了模具间隙及板料厚度对波形片回弹后成形高度的影响。模拟分析表明,波形片弯曲成形的圆角处变形比较剧烈,其应力值较其他区域值更大,且回弹后应力值的减小使得板料发生回弹,而回弹使得波形片成形高度降低,从而影响离合器从动盘总成的弹性;波形片的成形高度随着模具间隙的增大而减小,而随着板料厚度的增加而增大。试验结果表明,当板料厚度分别为0.6和0.8mm时,试验值与模拟值的误差变化范围分别为5.44%~7.54%和4.52%~5.93%,模拟结果与试验结果取得较好的吻合性。 For the cushion segment of clutch, the FEM software of Dynaform was used to simulate the springback of cushion segment. The distributions of stress before and after the spingback were analyzed, and the influences of die clearance and thickness of blank on the height in cushion segment forming were studied. The results of simulation show that the deformation in the fillet of cushion segment is se- vere, the value of stress is larger than that of other regions, and the decrease of stress after springbaek leads the sheet to springback. While the springback makes the forming height of cushion segment decrease, therefore, it affects the elasticity of driven disk assembly. The forming height of cushion segment decreases with the increase of die clearance, while it increases with the increase of thickness. The results of experiment show that when the thicknesses are 0. 6 and 0. 8 mm, the ranges of error in experiment and simulation are 5.44% - 7.54% and 4. 52% -5.93% respectively, and the simulation results are agree with experimental results.
作者 刘奎武 边巍
出处 《锻压技术》 CAS CSCD 北大核心 2015年第3期127-130,共4页 Forging & Stamping Technology
基金 2013年度省科技支撑计划(工业)重点项目课题(BE2013009-4) 淮安市工业支撑项目(HAG2011014)
关键词 波形片 回弹 数值模拟 模具间隙 板料厚度 cushion segment springback numerical simulation die clearance sheet thickness
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