摘要
概述了电子工业用锡及锡基合金(如锡–银、锡–铜和锡–铋)电子电镀技术的发展现状,重点探讨了了相关电镀工艺、镀层锡晶须生长问题和锡及锡合金电镀在先进封装中的应用现状,最后展望了电子工业用锡及锡合金电镀未来的发展趋势。
The recent advances of tin and tin alloys （such as tin-silver, tin--copper, and tin-bismuth） electroplating in the electronic industry were reviewed. Related electroplating processes, tin whisker growth in coatings, and application status of tin and tin alloy electroplating in advanced electronic packaging were discussed. The future development tendency of tin and tin alloy electroplating in the electronics industry was predicted.
出处
《电镀与涂饰》
CAS
CSCD
北大核心
2015年第4期217-222,共6页
Electroplating & Finishing
关键词
锡
锡合金
电镀
晶须
封装
电子工业
tin
tin alloy
electroplating
whisker
packaging
electronic industry
