硝酸银在聚酰亚胺薄膜表面化学镀铜中作用

Effect of Silver Nitrate on Electroless Copper Plating on the Surface of Polyimide Film

硝酸银在化学镀的过程中常作为催化剂,实验研究发现,硝酸银在聚酰亚胺薄膜表面化学镀铜时,不仅起到催化剂的作用,还有增加聚酰亚胺薄膜和化学镀铜层结合力的作用。实验采用Na OH溶液对聚酰亚胺表面进行改性,利用不同浓度的硝酸银溶液进行活化,将吸附在聚酰亚胺薄膜表面Ag+还原,进行化学镀铜。使用红外光谱仪对聚酰亚胺的表面结构进行表征和分析,利用3M胶带粘贴法测试镀铜层与聚酰亚胺薄膜的结合力,利用X-射线衍射、扫描电子显微镜表征铜镀层结构及表面微观形貌。结果表明,当硝酸银在一定浓度范围内变化时,硝酸银浓度对化学镀铜层质量和化学镀铜沉积速度无明显影响,但对镀铜层与聚酰亚胺薄膜的结合力影响很大。

Silver nitrate was used as catalyst in electroless copper plating process. This study found that silver nitrate not only acted as a catalyst but also could increase the binding force between polyimide film and electroless copper coating in the process of electroless copper plating on polyimide film surface. In the experiment, the surface of polyimide was modified by NaOH solution, then activated by silver nitrate solution with different concentrations. Thereafter, surface adsorbed Ag＋ was reduced and the electroless copper plating was carried out. FTIR-ATR was used to characterize and analyze the surface structure of polyimide. 3 M adhesive tape method was used to test the binding force between polyimide film and elec- troless copper coating. X-ray diffraction and scanning electron microscopy were used to characterize the structure and surface morphology of copper coating. The resuhs showed that the variation of silver nitrate concentration had no significant effect on the quality of electroless copper coating and electroless copper deposition rate,however, it had great influence on the binding force between the copper coating and poly- imide film.