摘要
先采用聚乙烯吡咯烷酮(PVP)对空心玻璃微球(HGM)进行表面改性,再分别以铜氨离子为铜源、水合肼为还原剂、改性HGM为基体材料,采用无钯活化的化学镀法制得均匀包覆铜的HGM核壳复合粒子。采用扫描电子显微镜(SEM)、X射线衍射仪(XRD)和傅里叶变换红外光谱仪(FT-IR)分析了铜包覆HGM复合粒子的形貌、结构和成分。结果表明,反应温度为60°C时,铜包覆HGM的效果最好。反应体系中低浓度的铜离子有利于还原所得铜粒子在HGM表面形成均匀、致密的铜层。
Hollow glass microspheres (HGM) were modified by polyvinylpyrrolidone (PVP), and then evenly coated with copper by palladium-free electroless copper plating using copper ammonia ions as copper source and hydrazine hydrate as reductant respectively to form core-shell composite particles. The micromorphology, structure, and composition of the copper- coated HGM core-shell composite were analyzed using scanning electron microscope (SEM), X-ray diffractometer (XRD), and Fourier-transform infrared spectrometer (FT-IR). The results showed that the copper coating effect on HGM is the best at a temperature of 60 ~C. Low concentration of copper ions in reaction system is favorable for the formation of uniform and compact copper coating through the reduced copper particles on HGM surface.
出处
《电镀与涂饰》
CAS
CSCD
北大核心
2015年第5期246-250,共5页
Electroplating & Finishing
基金
贵州省优秀青年科技人才培养计划项目(黔科合人字(2011)01号)
贵州省科学技术基金(黔科合J字[2012]2259号)
贵州省社会发展科技攻关项目(黔科合SY字[2013]3121号)
贵州省工业攻关项目(黔科合GY字(2011)3043)
关键词
空心玻璃微球
聚乙烯吡咯烷酮
表面改性
化学镀铜
核壳复合粒子
hollow glass microsphere
polyvinylpyrrolidone
surface modification
electroless copper plating
core-shell composite particle