毫米波多芯片组装工艺优化研究

Process Optimization of Multi-chip-assembly of Millimeter Wave Interconnection

随着毫米波系统对模块小型化集成化的需求日益增长,多芯片组装工艺技术成为毫米波模块互连的关键手段。分析了芯片组装工艺的特点,同时基于毫米波MMIC芯片组装工艺要求,通过射频互连芯片组装间隙工艺设计保证、共晶焊接钼铜载体结构优化设计以及自动点胶粘片参数优化研究,给出了相应的优化设计措施,从而达到MMIC芯片组装工艺优化的目的。

With the increasing requirements of miniaturization and high integration of the millimeter-wave system modules, multi-chip-assembly has become the key technology in the interconnection of millimeter wave modules. The characteristics of chip assembly process were analyzed. Based on the technological requirements of chip assembly of millimeter wave interconnection, optimum processes such as slit width control of RF chip assembly, structural design optimization of Mo-Cu heat sink; automatic dispensing parameter and mounting parameter optimization were proposed in details. And then the optimum performance was obtained for MMIC chip assembly process.