杜洛埃有机介质上集成薄膜电阻工艺研究

Thin Film Resistor Integrated on Duroid Organic Material

杜洛埃有机介质广泛应用于高频微波集成电路,由于材料表面固有特性而增加了集成薄膜电阻的难度。通过改变杜洛埃介质表面的形貌获得良好的平滑表面,并采用薄膜电路制造工艺,实现了在无铜箔的杜洛埃介质上制作微波混合集成电路。已成功实现了功分器、微波天线等产品的制作。对集成薄膜电阻的性能进行了详细工艺分析和讨论。

Duroid organic media is widely used in the manufacture of high frequency microwave integrated circuits. It is difficult to integrate thin film resistor on Duroid due to the inherent characteristics of the material surface. Using thin film circuit manufacturing process achieved microwave hybrid integrated circuit on Duroid with no-copper foil by changing surface morphology to get good smooth surfaces. The power splitters, microwave antenna, and other products has successfully realized. The performance of the integrated thin film resistor was been analyzed and discussed in detail.