摘要
波峰焊过程中,桥接是常见的缺陷之一,96芯连接器也经常出现桥接现象。通过观察发现96芯连接器的桥接集中出现在最后两排引脚。对96芯连接器过波峰焊出现桥接现象的原因进行了分析,利用正交试验设计分析了各因子对桥接的影响程度,并对各因子对桥接的影响进行了定性分析。同时对托盘边缘到焊盘间距对桥接的影响进行了单独验证。最终为解决桥接问题提供了一些参考依据。
During the wave soldering process, bridging is one of the common defects, which often also takes place in 96-pins connector. It is found that bridging in the 96-pins connector appears in the last two rows of pins. The bridging reasons of 96-pins connector during the wave soldering process is analyzed, by using the orthogonal experiment design, analyze the impact of each factor on the bridging, and qualitatively analyze the effect of various factors on the bridging. At the same time the impact of the space between tray and pad on the bridging were independently validated. Finally, Provide some reference for solving the problem of bridging.
出处
《电子工艺技术》
2015年第2期102-104,124,共4页
Electronics Process Technology
关键词
波峰焊
桥接
正交试验设计
脱锡焊盘
Wave Soldering
Solder Bridging
Orthogonal Experimental Design
Pad for Solder Leading
