SiC_p/Al复合材料镀金工艺研究

Study Gold-plating Technology of SiCp/Al Packaging Material

对SiC体积分数高达60%以上的SiCp/Al金属基复合材料进行镀金工艺实验,工艺分步实施化学镀镍、热处理、电镀镍、电镀金步骤,得到的镀层表面光滑平整,没有明显的结瘤和夹杂,与基材的结合力强。该工艺作为SiCp/Al可焊性表面处理技术之一,兼具可接触导通、良好的焊接性能、能兼容各种助焊剂,对于铝基复合材料表面处理具有十分重要意义。

Study the deposition method of Al-60%SiC alloy that can be used for electronics packaging. Ni–Au multilayer coatings were produced by electroless plating, heat treating, and continuous and well adhered coatings have been developed. Investigated results indicated that the surface of film is smooth, and no gold coating spill over, be great adhesion to base. New surface treatment progress as one of the weld surface treatment technology on aluminum carbonize silicon alloy, can be used to contact conductive, good soldering performance, and can compatible with various solder. This technology has the significance for the aluminum composite material.