期刊文献+

一种聚合物平板微器件的制造方法

A Novel Method for the Manufacture of Polymer Flat Micropart
下载PDF
导出
摘要 以一种平板微器件-微流控芯片制造为研究对象,针对单一的注塑成型工艺难以保证器件的宏微形位误差的难题,提出了一种新颖的聚合物平板微器件集成制造方法。首先,设计并制造了一套注塑模具,其中采用双螺纹结构将微镶件和定模架相连,对注塑工艺参数进行优化,制得填充率接近1的平板微制件。然后,对平板微制件进行了基于视觉对准的铣削整形和热压整平,有效改善了制件的宏微形位误差和平面度误差。最后,利用加工的器件进行装配,形成微流控芯片,并对芯片进行了流量测试和疲劳测试。实验结果表明:采用提出方法制造的微流控芯片,各项精度指标和性能可以满足实际使用要求,工艺成果对同类器件的研发和生产提供了借鉴和指导。 It is diffwult to effectively control the macro-micro error of polymer fiat micropart only using a single process of injecting. In order to solve this problem, the fabrication of typical polymer flat micropart (microfluidic chip) was studied. A new integrated manufacturing method for polymerflat micro-part was presented:first, an injection" mould was designed, where the micro-insert was connected with the fixed mould base by the structure of double screw thread. The parameters for the injection molding were optimized to make the filling ratio of microchannels close to 1.0. Second, the milling based on vision alignment was suggested to decrease the form and position macro-micro error. Third, the hot-pressing process was applied to improve the flatness error of the micropart. Finally, the micro-part and another polymer plate were assembled together to form the microfluidic chip. With the microfluidic chip, both the flow characteristic and its fatigue peormance were tested. Experimental results showed that the accuracy and peormance of the micro-part could meet the requirements. Thus, the method of this paper provided a useful reference for the fabrication of similar microparts.
出处 《机械设计与制造》 北大核心 2015年第4期129-132,共4页 Machinery Design & Manufacture
基金 国家863项目"微纳米高通量标准化工艺技术与装备"(2012AA040406) 中央高校基本科研业务费(DUT14LAB07)
关键词 注塑成型 平板微制件 聚合物微器件 微流控芯片 Injection Molding Flat Micropart Polymer Micropart Microfluidic Chip
  • 相关文献

参考文献4

二级参考文献31

  • 1罗怡,王晓东,杨帆,刘冲.变温蠕变实验的COP微流控芯片热压制备[J].光学精密工程,2007,15(7):1090-1095. 被引量:7
  • 2蒋炳炎,沈龙江,罗建华,翁灿.微特征结构对导光板翘曲变形的影响[J].光学精密工程,2007,15(2):180-185. 被引量:10
  • 3申长雨,吴海宏,赵振峰.注塑制品内应力计算的非线性黏弹性本构方程[J].化工学报,2007,58(2):490-494. 被引量:5
  • 4LEE S J, LEE S Y. Micro total analysis system (mu-TAS) in biotechnology[J]. Applied Microbi- ology and Biotechnology, 2004,64 : 289- 299.
  • 5BOHM S, DILGER K, HESSELBACH J, et al.. Micro bonding with non-viscous adhesives [J]. Mi- crosystem. Technologies, 2006,12(7) :676-679.
  • 6LI J H, CHEN D, CHEN G. Low-temperature thermal bonding of PMMA microfluidic chips [J]. Analytical Letters ,2005,38(7) : 1127-1136.
  • 7USSING T, PETERSEN L V, NIELSEN C B, et al.. Micro laser welding of polymer microstruc- tures using low power laser diodes [J]. Internation- al Journal of Advanced Manufacturing Technolo- gy ,2007,33(1-2) : 198-20.
  • 8YUSSUF A A, SBARSKI I, HAYES J P, et al.. Microwave welding of polymeric-microfluidic divic- es [J]. Journal of Micromechanics and Microengi- neering, 2005,15 : 1692-1699.
  • 9TRUCKENMULLER R,AHRENS R,CHENG Y, et al.. An ultrasonic welding based process for building up new class of inert fluidic microsensors and actuators from polymers[J]. Sensors and Actu- ators ,2006,132(1) :385-392.
  • 10KIM J, JEONG B, CHIAO M. Ultrasonic bonding for MEMS sealing and packaging[J]. IEEE Trans- actions on Advanced Packaging, 2009,32 (2) : 461 - 467.

共引文献36

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部