基于正交实验与人因工程的生产改进应用

Application of Production Improvement on Orthogonal Experiment and Human Factors Engineering

结合质量控制与改进及人因工程在提高产品质量方面的应用,对电路板焊接车间的焊接工艺流程进行分析,通过因果图和排列图找出影响电路板质量的主要因素。运用正交实验设计及方差分析,找到最佳的烙铁温度、焊接时间与焊锡量组合。另外,通过人因工程的相关知识对工作人员的操作环境加以改进,以降低操作人员的疲劳程度,从而提高电路板的整体质量。

Based on the application of quality control and improvement in improving product quality,this paper analyzed the generalization of virtual enterprise,welding workshop and the welding process of circuit board,and through the causality diagram and arrangement diagram,we found enterprise product problems and influence factors of the quality in circuit board,then by comprehensive use of orthogonal experimental design and ergonomics knowledge,we finally found the best solder iron temperature,welding time and solder quantity combination. What＇s more,this paper improved the operating environment of operators by human factors engineering knowledge,and reduced operator＇s fatigue so as to improve the overall quality of the circuit.