高温老化条件下LED模组封装材料失效研究

Failure Analysis of Packaging Materials of LED Modules under High Temperature Aging Test

为了获得高温条件下封装材料对LED模组可靠性的影响,在125℃环境温度下,使用高温试验箱同时对四种不同的样品进行恒定温度的老化试验。结果表明:在高温试验条件下,没有使用硅胶和荧光粉的LED模组具有很高的可靠性;而硅胶的碳化以及随之产生的气体、阻碍散热的荧光粉都会使光照度加速衰减,同时使用硅胶及荧光粉会使光照度迅速衰减导致模组失效。

In order to analyze the influence of packaging materials on the reliability of LED modules under high temperature, aging tests were performed on four kinds of samples with different packaging materials at a constant temperature of 125 ℃ in a temperature cycling chamber. The dxperimental results show that under the condition of 125 ℃, LED modules without silica gel and fluorescent own the highest reliability. The carbonization of silica gel and the consequent outgassing will result in rapid luminance attenuation of LED samples. And the fluorescent had the similar influence to those samples. If both silica gel and fluorescent were used in one sample at the same time, the luminance will attenuate very fast, resulting in module failure.