摘要
目的设计合理的抛光工艺方案,获得平整的阵列光纤组件端面。方法采用单因素实验法研究抛光工艺参数对阵列光纤表面粗糙度与光纤凸起量的影响,利用光学表面轮廓仪与扫描电镜进行分析与观察。结果在抛光液磨粒质量分数为2%,抛光液流量为15 m L/min,抛光压力为50 k Pa,抛光盘转速为30 r/min的条件下,可以获得平整的阵列光纤组件端面。结论应用化学机械抛光技术加工阵列光纤组件,并设计合理工艺方案,可获得平整的阵列光纤组件端面,其表面粗糙度可低至42.6 nm,光纤凸起值可低至0.14μm。
Objective To obtain the flat end face of optical fiber array by designing proper polishing process plan. Methods The effects of polishing process parameters on the surface roughness of the optical fiber array and fiber projection were studied using single factor experiments, and the surface morphology was examined by Scanning Electronic Microscope and Optical Profilometer. Results Flat end face of optical fiber array was obtained under the conditions of particle concentration of 2%, polishing slurry flow rate of 15 mL/min, polishing pressure of 50 kPa, and rotation speed of 30 r/min. Conclusion Using chemical mechanical polishing to process optical fiber array, in combination with designing proper polishing process parameters, a perfect end-face of optical fiber array with surface roughness of 42.6 nm and fiber projection of 0.14 μm was achieved.
出处
《表面技术》
EI
CAS
CSCD
北大核心
2015年第4期132-136,146,共6页
Surface Technology
基金
国家自然科学基金(51275534)
湖南省自然科学基金(2015JJ2153)~~
关键词
阵列光纤组件端面
化学机械抛光
表面粗糙度
光纤凸起量
end face of optical fiber array
chemical mechanical polishing
surface roughness
fiber projection
