磁场模拟在磁控溅射/阴极弧离子镀中的应用

Application of Magnetic Field Simulation on Magnetron Sputtering and Cathodic Arc Ion Plating Deposition Techniques

针对磁控溅射和阴极弧离子镀沉积技术存在的局限性,采用有限元分析方法(Finite element method,FEM)进行磁场模拟,优化设计外加电磁线圈的结构和磁场分布位形,并应用于磁控溅射沉积透明导电氧化物和阴极弧离子镀沉积硬质薄膜中。分析了外加电磁线圈磁场对磁控溅射等离子体辉光变化、磁控靶磁场平衡度/非平衡度、以及线圈位置对等离子体特性和靶材利用率的影响。设计和制作了轴对称磁场和旋转磁场,研究了它们对阴极弧离子镀弧斑运动形貌和薄膜表面大颗粒等特性的影响。通过控制弧斑运动状态,可以得到不同程度的颗粒分布,实现颗粒的可控沉积,减少薄膜表面大颗粒的污染。

Aiming at the limitations in magnetron sputtering and cathodic arc ion plating deposition techniques, this paper introduces the optimal design of external electromagnetic coil structure and magnetic field configuration distribution, simulates the magnetic field by using the finite element method（FEM）, and applies the optimal design to deposition of transparent conductive oxides by magnetron sputtering and deposition of hard coatings by cathodic arc ion plating. The magnetic role of external electromagnetic coil on the glowing discharge plasma in magnetron sputtering was analyzed. The influences of the magnetic field balance/unbalance coefficient and the coil position on the plasma characteristics and utili- zation rate of the target were investigated. An axisymmetric magnetic field and a rotating magnetic field used in the ca- thodic arc ion plating were designed and produced, and their effects on the organization of spots moving and suppressing the macroparticles on the film surface were summarized. The results show that controllable particle size and distribution in cathodic arc ion plating can be realized by tuning the spots moving state, which is very efficient in reducing the contam- ination of macroparticles on the film surface.