蜂窝夹层结构基板脱粘问题分析

Debond Analysis of Honeycomb Sandwich Construction Substrates

蜂窝夹层结构基板经热真空试验后,其正面局部出现了鼓泡脱粘现象,脱粘形式有2种,一种为聚酰亚胺膜与网格面板脱粘,另一种为网格面板与加强板脱粘。通过对聚酰亚胺膜与网格面板脱粘界面的宏微观观察,确定两者在脱粘前粘接良好,为外力导致的脱粘;通过对网格面板与加强板脱粘界面的宏微观观察,及胶膜的红外光谱分析、DSC测试、挥发分测试,确定网格面板与加强板在脱粘前未形成良好的粘接,该不良粘接可能与设计、工艺控制有关,与胶膜质量无关。

Bubbly debonding occurred in the surface of the honeycomb sandwich construction substrates after thermal vacuum test. There were two kinds of debonding. One kind was debonding between polymide film and composite netting plate; another was debonding between composite netting plate and stiffened plate. Micro and macro observation was carried out on the debonding interface between polymide film and composite netting plate. The results indicated that polyimide film and composite netting plate bonded well. They debonded because of the external force. Micro and macro observation on the debonding interface between composite netting plate and stiffened plate was carried out. And FIR analysis, DSC testing and volatile determination of the adhesive film were also performed. The results indicated that composite netting plate and stiffened plate bonded poorly. The poor bonding is related to design or process control and has nothing to do with the quality of the adhesive film.