电子器件引脚电容储能焊接接头的组织性能研究

Study on structure and property of electronic device pin's joints by capacitor discharge welding

采用电容储能式微电阻点焊方法对电子器件引脚材料镀锡铜线进行焊接。研究电极压力和充电电压对镀锡铜线点焊接头组织和力学性能的影响。结果表明,焊后接头晶粒细小、无缺陷。电极压力和充电电压对焊接接头拉断力的影响相似,在固定一个参数的情况下,焊接接头拉断力随着另一个参数的增大而先增加后减小。在160 V充电电压和12 N电极压力下得到21.51 N的最大接头拉断力。

The joints of electronic device pins, tinned wire,were obtained by capacitor discharge micro resistance spot wehler.The influences of electrode force as well as charging voltage on structure and mechanical property of joint were studied.Results show that the grains of joint after welding become smaller and that no obvious flaws are fimnd.Electrude force anti charging voltage have the similar impact on the joint binding force.When fixing one parameter,the joint binding foree increases at first and then turns to decrease afterwards with the increase of another parameter.And the largest joint binding force of 21.51 N is obtained with the electrode force of 12 N and the charging voltage of 160 V.