用于PCB基板的高耐热性电解铜箔的表面处理

Surface Treatment of High Heat Resistance Electrolytic Copper Foil Used for PCB

研究高耐热电解铜箔表面处理工艺,依次进行粗化、固化、电镀Zn-Ni-Co三元合金、铬酸盐钝化、浸有机膜等工序,分析主要工序工艺参数的影响。结果表明,处理后的铜箔毛面呈暗红色,不含砷和六价铬等有害元素,具有优异的抗剥离强度以及耐热性、耐腐蚀和蚀刻性能,可以替代同类型的进口铜箔,应用于压制耐热板、无卤板和多层板。

The surface treatment technology of high heat resistance electrolytic copper foil is investigated. It is operated in sequence of coarsening, curing, Zn-Ni-Co based ternary alloy electroplating,chromate passivating, dipping for organic film. The influences of the main process parameters are analyzed. The results show that the treated copper foil has a black smooth surface,without harmful elements such as Cr6 ＋and As,with the excellent anti-peel strength and resistance to oxidation,corrosion and etching. Furthermore,the treated copper foil can replace the same type of imported copper foil for manufacturing heat-resistant,halogen free board and multilayer board.