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丙酮基和酒精-水基牙本质粘接系统粘接强度比较及粘接界面观察 被引量:3

Effect of Solvent Content on Microtensile Bond Strength and Interfacial Morphology of 2 Adhesive Systems to Acid Etched Dentin
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摘要 目的:比较丙酮基和酒精-水基两种不同溶剂类型的全酸蚀牙本质粘接系统粘接强度和粘接界面的微观形态。方法:选择24颗正畸治疗拔除的健康前磨牙,去除合面釉质层,随机分两组,每组选用一种"两步法"全酸蚀牙本质粘接系统:以丙酮为溶剂的Prime&Bond NT(PB组)和以酒精和水为溶剂的Single Bond 2(SB2)组,粘接后进行微拉伸力检测。以扫描电镜(SEM)和激光共聚焦扫描电镜(LCSM)观察两种牙本质粘接系统的粘接界面。结果:粘接强度PB组(29.49±4.01)MPa,SB2组微拉伸粘接强度为,SB2组为(30.03±4.33)MPa,无统计学差异。两种牙本质粘接系统均可充分渗入脱矿牙本质表层的胶原纤维网和牙本质小管内,形成混合层和树脂突,SB组混合层薄而均匀,树脂突长。结论:不同溶剂类型的两组牙本质粘接系统微拉伸粘接强度无差异,全酸蚀牙本质粘接系统在湿粘接状态下可以对牙本质形成良好的渗透。 Objectives: To compare the interaction of dentin with an acetone--based and an ethanol/water--based adhesive systems. Methods: A total of 24 intact young human premolars extracted for orthodontic reasons were used. The enamel of occlusal surfaces of these premolar teeth was removed and dentin was exposed. The specimens were split into 2 groups, 1 group for each bonding agent., acetone--based adhesive system (Prime Bond NT, PB) and alcohol--water--based (Single Bond2, SB2). Dentin adhesive systems were bonded to dentin according to man- ufacturers' instructions, composite layers were built up incrementally. Microtensile bond strength was determined, and the results were statistically analyzed using t--test with a 5 % level of significance. SEM and LCSM investiga- tion were performed for the qualitative evaluation of resin--dentin hybridization. Results: There were no statistically significant differences in bond strength between the adhesive systems. Both bonding systems could infiltrate well in- to the peritubular-- and intratubular. Hybrid layer and resin tags were formed. Hybrid layer of SB2 group was thin and rough, resin tags were long. Conclusion: Different solvent content had no influence on the microtensile bond strength of total--etch dentin adhesive systems.
出处 《口腔医学研究》 CAS CSCD 北大核心 2015年第3期272-275,共4页 Journal of Oral Science Research
基金 浙江省大学生科技创新活动计划(新苗人才计划)资助项目(2012R413024)
关键词 全酸蚀牙本质粘接系统 微拉伸粘接强度 粘接界面 扫描电镜 激光共聚焦显微镜 Total--etch dentin adhesive system Microtensile bond strength Bonding interface SEMLCSM
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参考文献8

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二级参考文献37

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