微纳米尺度单晶铜各向异性表面切削特性实验研究

Experimental Study on the Cutting Properties of Single Crystal Copper Anisotropic Surface in Micro-Nano Scale

利用纳米压痕仪和原子力显微镜对微纳米尺度下单晶铜各向异性表面在不同载荷和刻划速度下的切削特性进行实验研究。结果表明:单晶铜各晶面表面在较低载荷下,划痕细小且不明显。随着载荷的逐渐增大,划痕深度和宽度逐渐变大,并形成明显的沟槽,在沟槽的两侧出现明显的侧流现象,探针前方出现切屑堆积,尤其单晶铜Cu(100)切屑堆积较明显;单晶铜Cu(100)在刻划速度为10μm/s、50μm/s时,切削力无明显变化规律,其余两晶向都是在同等载荷下,刻划速度越大,切削力越大。随着刻划速度的增大,切削力趋于稳定;载荷越大,切削力越大,其相应摩擦系数也增大。

The cutting properties experiment of single crystal copper anisotropic surface in the micro-nano scale was researched by nano-indenter and atomic force microscopy. The result shows that., at low load conditions, on the each plane of single crystal copper surface the scratch depth is shallow, small and not obvious. With the load gradually increasing, the scratch width and depth are increased, and the groove is formed. The phenomenon of lateral flow is obvious on the groove both sides, and in front of the probe occurs chip accumulation. In particular, the chip accumula- tion of single crystal copper Cu（100） surface is more obvious, when the scratching speed is respectively 10μm/s, 50 μm/s, the cutting force is not significant variation. The others crystal under the same load, the cutting force increases with the increasing scribe speed. When the scratching speed becomes bigger, the cutting force tends to more stable and less fluctuate. With the increase of the load, the cutting force and the corresponding coefficient of friction are increased.