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基于化学机械抛光过程的超薄不锈钢基板表面特性分析 被引量:2

Analysis of Surface Characteristics of Ultra-thin Stainless Steel Substrate Based on Chemical Mechanical Polishing Process
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摘要 研究超薄不锈钢基板表面特性有利于了解和分析超薄不锈钢化学机械抛光(CMP)的接触机制及材料去除机制。使用SEM、OLS4000激光共聚焦显微镜、Mahr Surf XR20表面轮廓仪等仪器研究SUS304超薄不锈钢基板的组织结构与表面形貌、表面粗糙度、表面缺陷、力学性能等。测量和计算结果表明:SUS304超薄不锈钢表面缺陷一般为凹陷、折皱、锈蚀、划痕、结巴和麻点等,其厚度误差仅为0.4%,实际密度小于理论密度,其原始表面几何粗糙度为28.5 nm,原始表面均方根粗糙度为62.18 nm,原始表面轮廓偏离平均线的算术平均值为38.55μm。 Studying the surface characteristics of ultra-thin stainless steel substrate helps to understand and analyze the contact and material removal mechanism during its chemical mechanical polishing ( CMP ). The organizational structure, surface morphology, surface roughness, surface defects, mechanical properties, and so on, were studied with the SEM, OLS4000 laser confocal microscope, Mahr Surf XR20 surface profiler, etc. The results of measurement and calculation show that the SUS304 ultra-thin stainless steel's surface defects usually were depressions, wrinkles, rust, scratches, stuttering and hemp points, wits thickness error is only 0. 4%, the actual density is less than the theoretical density, its original surface geometric roughness is 28.5 nm, the original surface of the root mean square roughness is 62. 18 nm, the original surface's contour deviates from the average line' arithmetic mean is 38.55 μm.
出处 《润滑与密封》 CAS CSCD 北大核心 2015年第4期45-48,53,共5页 Lubrication Engineering
基金 国家自然科学基金项目(51175092) 教育部高校博士学科专项科研基金项目(20104420110002) 广东省自然科学基金项目(10151009001000036)
关键词 化学机械抛光 材料去除机制 超薄不锈钢基板 表面特性 chemical mechanical polishing material removal mechanism ultra-thin stainless steel substrate surface characteristics
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