酰基硫脲树脂的合成及其对Cu^(2+)的吸附性能研究

Research on the synthesis of acyl thiourea resin and its adsorption performance for Cu^(2+)

通过对苯二甲酰基二异硫氰酸酯与二乙烯三胺的界面缩聚反应,制备了一种含有硫脲基团的螯合树脂。产品基于对苯二甲酰基二异硫氰酸酯收率为91.92%。用红外光谱仪、扫描电子显微镜对树脂的化学结构、表面形貌、分散情况及其分布进行了表征。采用静态吸附法研究了该树脂对铜离子的吸附性能,树脂对Cu2+吸附在15 h后基本达到平衡,适宜的p H值在4.5左右,吸附量可达1.12 mmol/g。通过分析树脂吸附动力学和吸附等温线,表明对苯二甲酰基硫脲树脂对Cu2+的吸附规则遵循Boyd液膜扩散方程和Langmuir等温吸附方程,整个吸附过程为吸热过程。

The polymeric acyl thiourea resin was synthesized by the interfacial polycondensation of terephthaloyl diisothiocyanate and diethylenetriamine. The yield based on terephthaloyl diisothiocyanate for the resin was 91. 92%. Chemical structure,surface morphology,disperse state and its distribution of the prepared microcapsules were studied by means of FTIR and SEM. The adsorption properties of Cu2 ＋on resin were researched with static adsorption,the balance adsorption time was 15 h,and suitable p H was 4. 5,the capacity of Cu2 ＋was 1. 12 mmol / g. It turned out that the polymeric acyl thiourea resin on the adsorption of Cu2 ＋rules to follow the Boyd liquid membrane diffusion equation and Langmuir adsorption isotherm. In additon,the adsorption can be comfirmed as a type of endothermic progress.