LED封装用硅树脂的研究进展

Research Progress on Silicone Resin for LED Encapsulation

综述了用于LED封装材料的有机硅改性环氧树脂类和有机硅树脂材料的研究进展,介绍了有机硅改性环氧树脂的物理共混和化学共聚方法,以及使用有机硅树脂为LED封装材料的特色优势,有机硅树脂产品的制造工艺特点和目前现状,并展望了有机硅封装材料的未来可能的研究方向。

Advances in LED packaging materials for silicone-modified epoxy resins and silicone-based materials were reviewed, described the physical blend of the silicone-modified epoxy resin and the chemical copolymerization process, and the use of silicone resins for LED package characteristics and advantages of the material, manufacturing process characteristics of silicone resin product and the current situation and prospect of possible future research directions silicone encapsulating material.