摘要
双面对准精度是接触接近式光刻机的关键性能指标,介绍了一种检测此项指标的测量原理及应用该原理研制的双面对准精度测量系统,并对设备的部件构成及控制流程作了叙述。设备实际验证了检测原理,对50、75、100及150 mm圆形基片均可适用。
Double side aligning precision is a key indicator of Mask aligner. A measurement means and measurement system on double side aligning precision are introduced, and the components and the control process of the measurement system are detailed. The measurement means is validated by the measurement system which is applied to 50, 75, 100 and 150 mm circular substrate.
出处
《电子工业专用设备》
2015年第3期42-45,共4页
Equipment for Electronic Products Manufacturing
关键词
测试测量技术
光刻机
双面对准精度
双面对准精度测量系统
Test and measurement technology
Mask aligner
Double side aligning precision
Measurement system on double side aligning precision
