FPC产品封装成品率提升的研究

Research of Improvement for Flip-Chip Assembled Products yield

经过对倒装新产品的电性能测试数据分析,获取了智能卡产品倒装工艺的成品率数据,通过对倒装工艺过程的介绍,假设了成品率损失出现的可能原因,接着对假设进行了分析,找出了成品率损失与芯片制造的关联性,提出了封装设计的解决方案,通过对相关的制程的改进,提升了该产品的成品率。最后,通过对封装工艺的进一步分析,提出了封装工艺改善的措施,得到了该类产品成品率提升的途径与相关的结论。

Yield loss in flip-chip product is firstly defined by analyzing the electronic test result of flip-chip assembled chip card modules. Procedures of Flip-chip process are introduced to induce a hypothesis of yield loss. The relationship between the yield loss and wafer manufacturing process is therefore found. Improvement method is suggested to yield loss. Furthermore, after the assembly process is discussed in depth, an improvement of assembly process is proposed. Methods and conclusions of improvement yield are obtained for flip-chip assembly.