炭纸表面化学镀铜工艺优化

The optimization of chemical plating copper on carbon paper

炭纸具有均匀的多孔质结构，本实验采用化学镀法在炭纸表面镀铜对炭纸进行改性，得到炭纸表面均匀分布的球形铜颗粒。论文重点研究了铜离子浓度、络合剂种类及浓度、pH及温度因素对化学镀铜沉积速率及镀层厚度的影响，进而确定了炭纸表面化学镀铜的最佳工艺。并且对炭纸表面铜颗粒进行900℃热处理，得到了较为规则的球形颗粒，且其表面分布有纳米针状结构。

Carbon paper has uniform porous structure. Copper was deposited on carbon paper through chemical plating method to get carbon paper with homogenous distribution of spherical copper particles in this paper. Effect of copper ion concentration, different complexing agent and concentration, pH and temperature on the deposition rate and coating thickness of plating copper on carbon paper were investigated in detail. As a result, the optimal condition of chemical plating on carbon paper was obtained. Then the copper circumstance after thermal treatment of 900℃, whose surface distributes nano acicular structure, was explored.