关于召开2015年中国半导体封装测试技术与市场年会（第十三届）的通知

A Brief Discussion of the Progress Management, Investment and Quality Control for the Integrated Circuit Packaging and Testing Projects

中国半导体行业协会中半协[2015]002号各有关单位：中国半导体封装测试技术与市场年会,是国内唯一涵盖整个半导体封测行业的最有影响力的专业研讨会。大会已经在天水、广州、连云港、成都、苏州、大连、无锡、深圳、烟台、北京、南京、重庆成功举办过十二届。第十三届年会将由工业和信息化部电子信息司、中国电子学会指导,中国半导体行业协会主办,由中国半导体行业协会封装分会和西安经济技术开发区承办。经协会和西安经开区领导研究商定第十三届年会将于2015年6月10-12日在西安召开。

The dynamic control management in progress, investment and quality for the project targets of IC packaging and testing has been tentatively studied in the paper. Moreover, the project target value, the actual value and the measures to rectify the deviations by comparing between the project target value and the actual value have been determined in order to supply the reference methods of scientifically and effectively carrying out the projects of IC packaging and testing.