摘要
通过对半导体封装工艺中芯片拾取过程及影响芯片拾取的关键参数研究,用正交试验法设计并试验,得出了对于特定试验对象最优的参数值组合,找出了对芯片拾取有较大影响的3个参数,可用于今后芯片拾取研究的参考。
This paper analyzed the Pick-up Process of Flip-chip. Several experimental parameters were researched. The optimal combination of parameters for the test chips is obtained By the orthogonal experiment design. Three parameters which have a greater impact on the Pick-up Process were found.The results of this paper have value for further research of pick-up process.
出处
《电子工业专用设备》
2015年第1期21-24,47,共5页
Equipment for Electronic Products Manufacturing
关键词
IC芯片
正交试验设计
芯片顶起
拾取
IC chip
Orthogonal experimental design
Jack-up process of chips
Pick-up process
