NASA《密封性检测现状》研究报告读评

A Study and Commentary on NASA Electronic Parts and Packaging Hermeticity Task Overview

通过对2013年美国航空航天局电子元器件和封装部研究报告《密封性检测现状》的解读和评述,指出加严宇航高可靠电子元器件密封性检测判据是必要的;最新改进的美国军用标准密封性检测方法,仍存在贮存寿命的均衡性问题;一些内腔容积的密封件难以满足筛选和更长时间贮存后内部水汽不超过5 000 ppm要求的可靠性问题;高严密性检测和积累氦质谱组合检测,仍存在吸附氦的去除不能满足信噪比不小于3的可行性问题;积累氦质谱和光干涉组合检测,仍存在粗漏和细漏漏检率过高的可信性问题。指出作者已申请和正在申请的发明专利,以及已发表的文章,能为改进国内外密封性检测方法、标准和仪器,提供一套解决方案。

Based on the study and commentary of the article of Hermeticity Task Overview published by NASA Electronic Partsand Packaging （NEPP） in 2013, the author points out that it is necessary to tighten the criterion to test the hermeticity of the electronic components with high reliability used in aerospace. There are still unbalanced storage life issues in the latest US military standard hermeticity testing method. Besides, some reliability problems still exist, that is to say, some sealed components with certain cavity volume are diffieuh to meet the requirement that the internal vapor should be less than 5000 ppm after screening or longer time storage. What＇s more, the feasibility problem that the helium removing ean＇t satisfy the condition of signal to noise ratio less than 3 still has not been solved in the high rigor grade hermeticity test and accumulative helium combination leak test. And the problem of the high-leak-rate for gross leak and fine leak still remains in accumulative helium combination leak test and optical combination leak test.Finally, the author also introduces some applied or pending patents and some articles, in hope that a cohesive solution could be provided to improve the methods, standard, and instrument of hermeticity test both at home and abroad.