导轨承载式双转子研磨机构分析与设计

Analysis and Design of Double Guide Rail Bearing Dual Rotors Grinding Mechanism

为提高光学元件的加工研磨效率,本文通过分析影响研磨效率的工艺参数,结合研磨材料去除的运动特点,提出和设计了一种双导轨承载式双转子研磨机构,并对其公转、自转和升降运动进行分析,设计出了各运动部件机构,同时利用有限元软件对其关键承载件进行优化设计,为轻量化设计提供了参考。

In order to improve the grinding efficiency of optical elements, the bearing type double rotor grinding mechanism of double guide rail was proposed and designed by the analysis of the influence of process parameters of the grinding efficiency, combined with the movement characteristics of abrasive material removal. Comparing its revolution,rotation and lifting movement, each motion component mechanism was designed. The key bearing parts are optimized by using finite element software, which provides a reference for the lightweight design.