无胶竹碎料板的性能研究

Properties of binderless bamboo particleboard

以3种不同形态的竹碎料为原料,不添加合成树脂,在不同热压温度条件下制备无胶竹碎料板,研究其性能特性。结果表明,随着热压温度的升高,3种无胶竹碎料板的内结合强度逐步增强,其中片状竹碎料压制的板材最高;同时,丝状和颗粒状竹碎料压制的板材吸水厚度膨胀率性能明显改善,190℃之前片状竹碎料压制的板材吸水厚度膨胀率性能最好,190℃时丝状和颗粒状竹碎料压制的板材出现严重炭化现象使吸水厚度膨胀率优于片状竹碎料压制的板材;另外,丝状竹碎料压制的板材静曲强度和弹性模量最大。竹碎料板的弯曲破坏模式主要包括下表面拉断、芯层剪切破坏,而拉伸破坏模式主要指中间芯层脆性断裂。

The objective of this paper is to evaluate some properties of binderless bamboo particleboard which was glued by extracted natural activator at different hot pressing temperature.The results reveal that all types of binderless particleboard are enforced at internal bond strength(IB)with increasing pressing temperature,and maximum one is made by slice chips.In addition,thickness swelling rate of water absorption(TS)has improved largely for the board made by slender and pelleted chips accordingly.But the best one is made by slice chips below 190℃ while it becomes to be the worst one when pressing temperature is above 190℃.Among all types of the species,the maximum modulus of rupture(MOR)and modulus of elasticity(MOE)come from binderless particleboard made by slice chips.The failure mode of bending test includes tensile failure of bottom surface and core shear failure while core tensile non-plastic crack is the main failure mode of transverse tensile test.