引线框架铜合金材料的研究现状及发展趋势

Research Status and Development Trend of Lead Frame Copper Alloy Materials

集成电路的发展对引线框架材料的要求不断提高,具有优良的导电性、导热性和高强度是引线框架铜合金材料的主要性能要求;但从国内外引线框架铜合金材料的市场应用和生产技术情况看,我国自主研制生产的铜基引线框架材料无论是质量还是数量与工业发达国家相比差距较大。坚持研制铜合金新的成分体系、新的制备工艺是开发高强高导引线框架铜基材料的方向。

The requirement of lead frame materials has constant increased with the development of integrated circuit, lead frame copper alloy materials has some performance requirements, such as good electric conduction, heat conduction and strength; seeing from market application and condition of production technology of lead frame copper alloy materials at home and abroad, copper-base lead frame materials independently designed and produced by our country has a gap both in the quantity and in the quality when comparing with industrial developed country. The paper points out that new composition system and new preparation technology of copper alloy is the direction of developing high-strength and high-conductivity lead frame base-base materials.