双阿累尼乌斯方程在湿法缠绕环氧树脂中的应用

Application of Dual-Arrhenius Equation in Epoxy Resin for Wet Filament Winding

为解决双阿累尼乌斯方程在模拟湿法缠绕用酸酐固化环氧树脂和芳香胺固化环氧树脂黏-温特性时出现较大误差的问题，对方程频率因子4和活化能因子M进行了探讨，在其表达式中增加时间变量t，得到新的双阿累尼乌斯方程表达式，并模拟实际固化温度下两种树脂的黏-温特性，对所建立的方程进行了验证。结果表明，时间变量的加入是合理的，新方程可准确模拟两种树脂的黏-温特性，预报不同工艺条件下树脂的黏度，确定酸酐固化环氧树脂在40-50℃符合湿法缠绕的要求，最佳缠绕温度为45℃；芳香胺固化环氧树脂在40℃和45℃符合湿法缠绕的要求，最佳缠绕温度为45℃。

In order to solve the problem that a serious error may occur when the dual-Arrhenius equation is used for simulating viscosity-temperature characteristics of epoxy resin cured by anhydride and epoxy resin cured by aromatic amine for wet filament winding, the frequency factor A and activation energy factor N in the dual-Arrhenius equation were discussed and the time variable t was added in the expression, thereby a new dual-Arrhenius equation expression was got and the established equation was verified by simulating the viscosity-temperature characteristics of the two different types of epoxy resins under the actual curing temperature. The result show that adding the time variable t is reasonable and this new equation can be used for simulating the viscosity- temperature characteristics of the two types of epoxy resins accurately and predicting the viscosity of resins under different process conditions, it is confirmed that the epoxy resin cured by anhydride meets the requirements of wet filament winding at 40-50℃ and the most suitable winding temperature is 45 ℃ while the epoxy resin cured by aromatic amine meets the requirements of wet filament winding at 40T： and 45 ℃ and the most suitable winding temperature is 45 ℃.