高体积分数β-SiC_P/Cu复合材料的制备及性能研究

Study on Fabrication and Properties of High Volume Fraction β-SiC_P/Cu Composite

利用化学镀铜方法对β-Si C颗粒进行表面改性,结合热压烧结技术制备了50%Si C体积分数的β-Si C_P/Cu复合材料,探讨了β-Si C颗粒化学镀铜工艺和烧结温度对该复合材料微观结构、相对密度、抗弯强度和热膨胀系数的影响。结果表明:镀铜后β-Si C颗粒表面均匀地包覆一层铜膜,烧结后复合材料Si C颗粒在基体中分布均匀,界面结合良好。β-Si C_P/Cu复合材料相对密度和抗弯强度随烧结温度升高而增大;热膨胀系数随烧结温度升高而降低。利用化学镀改性β-Si C颗粒制备的β-Si C_P/Cu复合材料性能均优于未利用化学镀改性β-Si C颗粒制备的复合材料,这是由于β-Si C颗粒镀铜可有效改善Si C-Cu的界面结合状态。当烧结温度为750℃时,β-Si C_P/Cu复合材料的相对密度和抗弯强度最高,热膨胀系数最低。

Ca-coated β-SiC powder was fabricated by electroless plating technology, and β-SiCp/Cu composite was fabricated by hot-press sintering with 50% SiC volume fraction. The effects of sintering temperature and surface modification on the microstrueture, relative density, bending strength and coefficient of thermal expansion （CTE） were researched in detail. The results show that the surface of SiC particles are uniformly coated with copper and the SiC particles are also uniformly distributed in matrix of β-SiCp/Cu composite after hot-press sintering. The relative density and bending strength of the composite increases with increasing sintering temperature, the change of CTE is opposite. The properties of the composite modified by Cu-coated SiC particles are much better than that of the composite without modified SiC particles, which indicates that the eletroless plating technology can improve the interface bonding between SiC and Cu effectively. The most excellent properties of the composite can be obtained at 750℃.