某弹载毫米波功率放大器结构设计

Structure Design of a Missile-borne MMW Amplifier

随着电子技术的迅猛发展,雷达、通讯、电子对抗等电子设备的整机功率越来越高,体积要求越来越小,因而电子设备的小型化设计和热设计就显得越来越重要。弹载设备的使用环境迥异于机载和地面,对其外形、体积、重量和质心都有严格的要求。毫米波功率器件是无封装的裸芯片,如何对其进行有效防护,是提高设备寿命和可靠性的关键。文中从质量、质心设计及防护设计等方面,介绍了一种弹载毫米波功率放大器的实现过程。

With the fast development of electronics technology, it is required that the system power of the electronic equipment such as the radar, telecommunication and ECM is higher and higher and the volume is smaller and smaller. Thus miniaturization design and thermal design of the electronic equipment become more and more important. The operation environment of the missile-borne equipment is different much from that of the airborne equipment and ground-borne equipment. More strict requirements of shape, volume and mass centre are necessary in missile-borne equipment. The protection design of the naked MMW chips is one of the key factors in endurance and reliability of the equipment. A missile-borne MMW power amplifier is introduced in this paper from the mass, mass centre and protection design.