LED编带机热压头的热分析与优化设计

Thermal Analysis and Optimization Design for Thermal Head of LED Taping Machine

目的针对LED编带机热压头间接加热方案效率低的问题,利用Solid Works对其进行实体建模,并导入Ansys中进行热分析与优化设计,提出新型的直接加热方案。方法根据SMD器件编带包装的基本要求,具体结合片式LED编带机热压封装的基本原理,引入有限元热分析概念,通过Ansys有限元分析软件,对直接和间接加热方案进行热分析。结果热压头直接加热方案优于间接加热方案,兼具有升温速度快、温差小和结构简单等优点。结论热压头直接加热方案是一种可行的替代方案,为具体设计实施提供了理论依据。

Targeting at the problem of low efficiency of the indirect healing scheme of the thermal head of LED taping machine, solidworks was used for solid modeling, and thermal analysis as well as design optimization were conducted in Ansys, in order to propose a novel direct heating scheme. According to the basic requirements of SMD device taping packaging, the basic principle of thermal sealing packaging of LED taping machine was combined, the concept of finite element thermal analysis was introduced, and Ansys finite element analysis software was used to perform thermal analysis for the direct and indirect heating schemes. The result finally suggested that the scheme of thermal head direct heating was better than the indirect heating scheme, which had the advantages of fast warming, simple structure and Small temperature difference. In conclusion, the scheme of thermal head direct heating was a feasible alternative, which provided theoretical basis for the implementation of specific design.