复杂互连结构传输性能分析及等效电路

Analysis for the Transmission Performance and the Equivalent Circuit of Complex Interconnect Structure

信号完整性在某种程度上已经成为了限制当前高速电子系统设计与发展的瓶颈。建立了由过孔、焊点、印制线构成的高速电路板复杂互连结构单元模型,在1~10 GHz频率范围内针对模型进行信号传输性能的研究。用高频结构仿真器（HFSS）针对不连续区域内印制线不同长度、焊盘不同半径进行仿真分析,总结这些参数对信号传输性能的影响,提出了复杂互连结构的等效电路模型,并提取参数值进行对比验证。结果表明,随着印制线长度的增加、焊盘半径的增加,信号传输的回波损耗（RL）越来越强。用先进设计系统（ADS）软件对等效电路进行模拟,其回波损耗在1~6 GHz频率范围内与HFSS仿真结果相差不超过1 d B,在6~10 GHz频率范围内相差不超过2 d B。

The signal integrity has become a bottleneck in a certain extent, and limits the design and development of the current high-speed electronic system. A high-speed circuit board complex inter- connect structural unit model was established, which consisted of via holes, solder bails and traces. And the signal transmission performance of the model within the frequency range of 1-10 GHz was studied. The different length traces and the different radius pads in the discrete region were simulated by using the high frequency structure simulator （HFSS）. And the effects of the parameters on the signal transmission performance were summarized. An equivalent circuit model of the complex interconnect structure was presented, and the parameters values were extracted for comparison and validation. The results show that the return loss （RL） of the signal transmission is growing with the increase of the length of the traces and the radii of the pads. The equivalent circuit was simulated using advanced design system （ADS）. Compared to the simulated results using HFSS, the return loss is no more than within 1 dB in the frequency range of 1-6 GHz, and the return loss is no more than 2 dB in the frequency range of 6-10 GHz.