摘要
介绍了CSOP型陶瓷小外形外壳的结构特征及产品的关键工艺技术解决方案。对提高隔离电阻电压、降低水汽含量以提高气密性筛选合格率、外引线共面性、瓷体外观控制、印刷和穿孔注浆精度等5项专题进行了较深入的研究。研究成果能较好地指导CSOP型陶瓷小外形外壳的批量生产。
The paper introduces the key technology structure and product type CSOP ceramic small shape shell solutions, to improve the isolation resistance voltage; reduce the water vapor content, improving air tightness screening qualified rate; outer lead coplanarity; porcelain body appearance control; printing and perforation routing precision five topics are studied further, can better guide the CSOP type ceramic small shape shell mass production.
出处
《电子与封装》
2015年第4期9-13,共5页
Electronics & Packaging
