摘要
聚酰亚胺因其良好的绝缘性能使得材料表面容易产生静电,静电的积累会引起燃烧、爆炸等危险,因此如何消除其表面静电是人们长期以来探索的重要课题之一。本文主要介绍了静电产生的机理、静电带来的危害及其危害机理,综述了碳系、金属及金属氧化物系、导电高分子系及离子注入改性4类抗静电聚酰亚胺薄膜的研究进展,并展望了抗静聚酰亚胺薄膜未来的发展趋势。
Polyimide is easy to produce electrostatic because of its excellent insulating property, and the accumulation of electrostatic may lead to combustion and explosion, thus how to eliminate the surface electrostatic is one of the important subjects for a long time. The generation mechanism of electrostatic, and damage brought by electrostatic and damage mechanism were intruduced mainly. The research prog- ress of antistatic polyimide film materials modified by carbon, metal and metallic oxide, conductive filler, and ion implantation was summarized, and their future prospects were proposed.
出处
《绝缘材料》
CAS
北大核心
2015年第5期6-9,共4页
Insulating Materials
关键词
聚酰亚胺
抗静电
导电填料
离子注入技术
polyimide
antistatic
conductive filler
ion implantation technique
