分离母板微型互联技术

Micro-interconnection Technology of Separated Motherboard

针对分离式母板互联的互联空间小、互联母板中的台阶板组装难和互联短路等问题,通过对分离母板组装、精度控制等技术进行研究,确定了微型互联技术,采用丝印模板开口技术和方波形精度控制技术,解决了分离式母板微型互联技术难题。

Aimed at the separated motherboard intereonneclion problems of little interconneclion space, difficulty in step plate assembly, short circuit in interconneclion, etc. , the technology of separated motberboard assembly, accuracy control and so on were researched, and also the micro interconneetion lechnology had been eslablisbed. The technology of windows screen printer and the technology of precision control edge of rectangular wave were used to solve the mentioned problems.