军用印制电路组件气相沉积促进工艺技术

Vapor Deposition Promoting Technology of Military Printed Circuit Module

对聚对二甲苯Parylene C真空气相沉积促进工艺进行了全面研究。通过附着力测试,确定了促进剂和促进工艺。并对Parylene C涂层的三防性、耐热性、耐介质性进行了考核。结果表明:在最佳促进参数条件下,附着力达到1级,各项性能指标均满足军用印制电路组件三防技术要求。

Acomprehensive study of the vacuum vapor deposition promoting technology on the paryleneC is conducted. The accelerant and promoting technology are determined by the adhesion test. The as- sessment on resistance to salt spray, heat and chemistry of the paryleneC is made. The result indicates that tinder the optimal promoting technology parameters, when the adhesion strength reaches level 1, all performance in- dicators match the three-protection technology require- ments of the military printed circuit module.