摘要
分析了波峰焊与回流焊的焊接工艺流程,在此基础上对比了这两种工艺常见缺陷的相同之处与不同之处,并分析了产生这些缺陷的原因。
This essay analyzes the welding process of wave soldering and reflow soldering firstly ,then compares the similarities and differences in the common defects of two kinds of processing ,and finally analyzes the causes of these defects .
出处
《武汉船舶职业技术学院学报》
2015年第2期36-38,共3页
Journal of Wuhan Institute of Shipbuilding Technology
关键词
回流焊
波峰焊
气孔
锡珠
桥接
Reflow Soldering
Wave soldering
stoma
Solder Bearing
Bridging