SiC对加成型导热电子灌封胶性能的影响

Effects of SiC on Properties of the Thermal Conductive Addition- type Liquid Silicone Rubber

以端乙烯基硅油为基胶,Si C为填料,含氢硅油为交联剂,铂配合物为催化剂,制备了双组分加成型有机硅电子灌封胶。通过对样品的热导率、微观形貌、黏度、电绝缘性、热稳定性和力学性能进行表征,分析Si C对导热有机硅灌封胶性能的影响。结果表明:随着Si C添加量的增加,加成型有机硅灌封胶的热导率增加,但黏度上升。当Si C添加量为33.3%(体积分数)时,热导率达0.733 W/(m·K),比纯灌封胶提高了261.1%;Si C的加入改善了材料的热稳定性和力学性能;灌封胶的介电常数有所增加、体积电阻率减小,但仍能满足材料电绝缘性能要求。

Thermal conductive silicone nohydrogenpolysiloxane as crosslinking encapsulant was prepared with vinyl silicone oil as matrix, orga - agent, chloroplatinic acid - V4 as catalyst and SiC as thermal con- ductive filler. The effects of different SiC contents on thermal conductivity, microtopography, viscosity, mechanical, heat stability and electrical properties of silicone encapsulant were investigated. The results show that the thermal conductivity as well as viscosity increases with the SiC content increasing. When the SiC particle filler content is 33.3% (volume fraction), the thermal conductivity of the silicon reaches to 0. 733 W/( m · K), improves by 261.1% compared with pure encapsulant. The addition of SiC is bene- ficial for improving the thermal stability and mechanical properties of materials. The dielectric constant in- creases with the filler content increasing while the volume resistivity decreases.